JPS5118320B2 - - Google Patents

Info

Publication number
JPS5118320B2
JPS5118320B2 JP47020586A JP2058672A JPS5118320B2 JP S5118320 B2 JPS5118320 B2 JP S5118320B2 JP 47020586 A JP47020586 A JP 47020586A JP 2058672 A JP2058672 A JP 2058672A JP S5118320 B2 JPS5118320 B2 JP S5118320B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47020586A
Other languages
Japanese (ja)
Other versions
JPS4919786A (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47020586A priority Critical patent/JPS5118320B2/ja
Priority to US00336997A priority patent/US3840769A/en
Publication of JPS4919786A publication Critical patent/JPS4919786A/ja
Publication of JPS5118320B2 publication Critical patent/JPS5118320B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP47020586A 1972-03-01 1972-03-01 Expired JPS5118320B2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP47020586A JPS5118320B2 (en]) 1972-03-01 1972-03-01
US00336997A US3840769A (en) 1972-03-01 1973-03-01 Light-emitting display device having light emitting elements surrounded by black ceramic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47020586A JPS5118320B2 (en]) 1972-03-01 1972-03-01

Publications (2)

Publication Number Publication Date
JPS4919786A JPS4919786A (en]) 1974-02-21
JPS5118320B2 true JPS5118320B2 (en]) 1976-06-09

Family

ID=12031319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47020586A Expired JPS5118320B2 (en]) 1972-03-01 1972-03-01

Country Status (2)

Country Link
US (1) US3840769A (en])
JP (1) JPS5118320B2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208499A (ja) * 1984-03-20 1985-10-21 オスシ・ガルヴァノ・エス・アー 電気メツキ用装置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548700B2 (en]) * 1973-01-30 1980-12-08
DE2340584A1 (de) * 1973-08-10 1975-02-20 Stengelin Volker Tauchtropfkoerperanlage
JPS5516473B2 (en]) * 1974-05-20 1980-05-02
JPS528651A (en) * 1975-07-09 1977-01-22 Kurita Water Ind Ltd Rotary type waste water cleaning device usig aerobic system
DE2551956C3 (de) * 1975-11-19 1978-08-03 Heimann Gmbh, 6200 Wiesbaden Photoempfindliche Matrix mit einem Substrat
JPS5264146A (en) * 1975-11-22 1977-05-27 Asahi Chem Ind Co Ltd Biochemical rotary contactor for purifying dirty water
JPS5313351Y2 (en]) * 1976-03-15 1978-04-11
JPS5725757Y2 (en]) * 1976-12-30 1982-06-04
FR2378324A1 (fr) * 1977-01-20 1978-08-18 Radiotechnique Compelec Perfectionnement a la realisation de dispositifs d'affichage
JPS53122061U (en]) * 1977-03-08 1978-09-28
JPS5712769U (en]) * 1980-06-24 1982-01-22
US4394600A (en) * 1981-01-29 1983-07-19 Litton Systems, Inc. Light emitting diode matrix
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
KR910007646Y1 (ko) * 1988-10-27 1991-09-30 삼성전관 주식회사 칼라 플라즈마 표시소자
JPH0546229U (ja) * 1991-11-28 1993-06-22 株式会社ササキコーポレーション ニンニク等の掘取機
US20030193055A1 (en) * 2002-04-10 2003-10-16 Martter Robert H. Lighting device and method
CN101409320B (zh) * 2007-10-09 2010-06-23 富士迈半导体精密工业（上海）有限公司 基板制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208499A (ja) * 1984-03-20 1985-10-21 オスシ・ガルヴァノ・エス・アー 電気メツキ用装置

Also Published As

Publication number Publication date
JPS4919786A (en]) 1974-02-21
US3840769A (en) 1974-10-08

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